Defence - Fighter Plane

Microelectronics Lid Seal

There are two methods of lid-seal, depending on the build-standard of the hybrid.

For metal packs, a metal lid is seam-welded to the package in a dry-nitrogen atmosphere. The picture shows the process taking place in a glove box where two copper rollers deliver high current pulses, welding the lid in place.

For ceramic packs, a ceramic cavity lid is affixed to the substrate using an epoxy mat. Again the sealing process takes place in a dry-nitrogen atmosphere.

Chip-on-board designs are protected by localised application of a silicone bond protection, usually with an overall epoxy coating.

Lid Seal

Product Miniaturisation in the UK

Find out more

Talk to our Experienced Sales Team

Contact us

Access Reports in our Secure Customer Portal

Log In

Download the details CEMS brochure (1.6MB)

Download now