There are two methods of assembly; epoxy die attach, and solder attach.
For most high-reliability applications, chip and wire is the preferred build-standard. Silver-loaded conductive epoxy, or polyamide is screen printed onto the substrate and bare-chip silicon devices are placed on the wet epoxy. Capacitors are also added at this stage. The picture shows the process, using a vacuum pick-and-place machine. When the circuit is fully loaded with components, and after an inspection stage to check position and orientation, the circuits are placed in an oven where the epoxy cures. The circuit is now ready for wire-bonding.
The other method of assembly uses conventional small-outline devices and soldering techniques to produce single or double-sided circuits, using the printed ceramic substrate as the circuit board.